K5 Pro Thermal Putty Pad Replacement Compound 20g

Product Description

K5-PRO thermal paste

K5-PRO viscous thermal paste is developed and produced by Computer Systems laboratories research department. This product was developed as part of C.S. Labs BGA rework research project with the support of Greece and European Union. This product is designed to reduce the chances of BGA component failure for reasons related to overheating. This listing is offering a packet of K5-PRO gummy thermal paste .This packet includes 20g of K5-PRO gummy thermal paste for use instead of soft thermal pads that are usually installed inside computers and other commercial electronics. This quantity is enough for about 40 applications.

Key features

•     K5-PRO is a high quality gummy thermal paste designed for use on memory chips and GPUs of various computers, including PS3 CECHAxx, Apple iMac A1235 video boards. This is the only commercially available product at the moment that can replace the gummy thermal paste that is originally used by Apple.
•     K5-PRO can replace soft thermal pads that are used on computers (up to 3mm thick).
•     K5-PRO has a thermal conductivity of K>5,3 W/m.K * (at least 3 times higher than common thermal pads that are used on computers and commercial electronics).
•     K5-PRO is applied very easily, directly on the component, and has no electrical conductivity. It can be heated up to 250 Celsius degrees and has a long operational life time (technically infinite after the installation).